Tecbond LM 44-12-200 Low Melt Hot melt adhesive for expanded polystyrene - White - 135 ° - stick 12 mm x 200 mm - Per box of 5 kg
Item No.
11112806
The low melt adhesive is suitable for bonding sensitive materials such as expanded polystyrene. The temperature is 135° and does not burn into the material. Fast setting, high performance, also for bonding balloons and other sensitive materials.
Description
The low melt adhesive is suitable for bonding sensitive materials such as expanded polystyrene. The temperature is 135° and does not burn into the material. Fast setting, high performance, also for bonding balloons and other sensitive materials.
Specifications
| Product Reference | LM44‐12‐200‐WEO‐BX05‐TEC |
| Brand Manufacturer | POWER ADH |
| Type of adhesive | Hotmelt |
| Colour | transparent |